UMF-Cleanroom (UMF-Cleanroom)
UMF cleanroom provides class 100, class 1,000 and class 10,000 environments (ISO 5, 6 and 7 respectively).
Class 100 room is a yellow room, which is designed for doing photolithography, while device fabrication and measurement would be performed in class 1,000 and class 10,000 environment. Equipment includes thin film deposition system, ink-jet printing system, plasma etcher, wire bonder, probe station etc.
Alert 1: From 1-Jan 2023, “Note” field in booking must be filled with approved Process Flow code (e.g Processflow-20000000R-221022-01). Booking with NO approved Process Flow code may be cancelled without noticed! For detail, please refer to Frequently Asked Question at below.
Alert 2: For safety reason required by CFSO, user would stay after 11:00 pm needs to register at security unit in advance everytime. User should obtain your supervisor approval and forward the approval and other information (Full name, Contact telephone number, Laboratory of stay, Duration of stay) to laboratory persons-in-charge by email. Security staff may ask you to leave immediately if no registration in advance.
Charging Scheme:
- Introduction of Cleanroom and Safety (compulsory): HK$150/user (internal); HK$180/user (Others)
- Lab access (internal: HK$50/user/day) + material cost + equipment cost
Useful Information:
- Cleanroom Introduction and Safety Video (all users should have a look)
- Frequently Asked Question (equipment training, booking, Process Flow, etc.)
- Submit Cleanroom Online Equipment Training Records
- Sample of Process Flow
30 minutes before the start of booking session. However it will take no more than 10 minutes to activate cleanroom door access, after the booking session is created.
Upcoming Training Session:
You will receive an email of successful registration if you are enrolled! Please check and don't enrol repeatedly.
Training Session for Denton Sputtering System
- Training Session will be held on 27 Nov at 10:30 am. Please click here to enroll. (P.S. Gather at Room HJ709)
Training Session for Harrick Plasma Cleaner and PVA TePla IoN Radical Plasma Cleaner
- Training Session will be held on 22 Nov at 10:30 am. Please click here to enroll. (P.S. Gather at Room HJ709)
Instruments
- Access Only 1
- Access Only 2
- Access Only 3
- Access Only 4
- Access Only 5
- Aixtron BM Pro 4 PECVD
- Atomic Layer Deposition System
- Bruker DektakXT Surface Profiler
- Denton E-beam Deposition System
- Denton Sputtering System
- Denton Thermal Evaporator
- EZ Imprinting PL400 Nano-imprinter
- F&K Delvotec 5630 Semi-automatic Wire Bonder System
- Harrick Plasma Cleaner
- Heidelberg Nanofrazor
- Inductively Coupled Plasma (ICP) Etcher
- Leica DM2700 Optical Microscopy (Yellow Room) [Photolithography Use ONLY]
- neaSNOM Scattering-type scanning near-field optical microscope
- Novascan UV Ozone
- OAI MBA800 Mask Aligner
- PixDro LP50 Ink-jet Printer
- Probe Station with Semiconductor Parameter Analyzer
- PVA TePla IoN Radical Plasma Cleaner
- Rapid Thermal Processor
- Sawatec HMDS Hotplate HP-200
- Sawatec SM-180-BT Easy Spin Coater
- Sawatec Spin Coater (Photoresist Only)
- SUSS MA6 Mask Aligner
- Wet Station for Acid/ Base
- Wet Station for Cleaning (Yellow Room)